Abstract— technologies. They revolutionized the digital world in the

Abstract— The
demand for high performance and low power electronics is increasing day by day needs
to mobile phones to its security systems. In each of these applications,
fundamental electronic components such as diode, transistor and metal oxide
semiconductor field effect transistor (MOSFET) etc are used. These are all made
of silicon and are called as silicon technologies. They revolutionized the
digital world in the last part of 20th century and the first of 21st
century. However there is a misconception that the silicon technologies now can’t
be scaled anymore and cannot be used for high performance based applications. However,
through innovations in materials and structures, it will continue to provide higher-performance
for all electronic devices in the coming decades.

 

                                                                                                                                                              
I.     Introduction

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The upcoming technologies in the field of the silicon are 3D IC’S
and TSV’S (Through silicon vias). All these new technologies will breed several
applications in the fields of Internet of Things, Health care and electronic
devices designs.

According to a research there will be more than 30 billion devices
will be connected to internet wirelessly. The amount of data that will be
created is 40 zeta bytes. We will require powerful systems and processors to
manage such huge amounts of data. In this paper we will discuss the future
directions of silicon technologies and data explosion.

 

                                                                                                                                            
II.    PROBLEM DESCRIPTION

CMOS technology has been scaled from 140 nm
to 10nm in the past three years itself. Scaling has been able to satisfy the
market need for both high-performance logic and low-power logic for more than
two decades. It is to hard to scale them now as it nears the 10nm node,
particularly in terms of power density and heat dissipation. But, theoretically
based on the Heisenberg uncertainty principle and tunneling, it can be scaled
to 3nm.While non-CMOS logic devices (SpinFETs and Nano magnets, and so on) and
new circuits/architectures are being identified as potential candidates, these
technologies have yet to prove their feasibility, which suggests that the basic
CMOS technology will continue to prevail for the coming decades.

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